Gobal Leader in Thermal Interface Materials

Thermal Pad Thermal Grease Thermal Conductive Insulator Silicone-Free Thermal Pad Thermal Putty Other Thermal Materials Thermal Phase Change Materials Custom Mould Thermal Pad Thermal Conductive Tape Custom Thermal Materials

TCP20 Series - Super Insulating Materials

Main Features: ◇ Thermal Conductivity: 0.20W/m.k ◇ High compressible closed-cell silicone foam ◇ Thermal insulating and low compressure Set Typical Applications Include: ◇ Ultra Soft and Highly compressible for low compression force

 

AL50 - Premium Thermal Conductive Pad

Premium Thermal Conductive Pad with Very High Conductivity, 50W/m.k; Typical Properties of TCP5000,35 and 50 W/mk Outstanding Thermal Conductivity

 

AL20 - Premium Thermal Conductive Pad

Premium Thermal Conductive Pad ( Innovative Thermal Products),Supper Thermal-Conductive Sheets: Carbon fiber filled. It has outstanding thermal conductivity. High material stability and suitable for extreme environment.

 

TCP100 - Thermal Conductive Pad/Cooling Soft Gap Pad

1.00 W/mk thermal conductivity,Economical, Electrically Insulating, Thermally Conductive, Soft Tack Elastomeric Material

 

TCP600 High Heat Conductivity Thermal Gap Filler Pad/Cooling

Between heat-generation Component and heatsink. 6.00 W/mk High Thermal Conductivity; Low Thermal Resistance at; Low PressureNaturally tacky for easy application

 

TCP150 Die Cut Thermal Conductive Pads Thermal Gap Filler

Die Cut Thermal Conductive Pads Thermal Gap Filler TCP150; 1.5 W/mk thermal conductivity; Low Thermal Resistance at Low Pressure; Easy assembly and application

 

TCP500 Thermal Gap Filler Pad/Heat Transfer Pad

0.25mm~15mm Thermal Gap Filler Pad/Heat Transfer Pad; 4.50 W/mk High Thermal Conductivity; Sheet size:200 x 400mm, 350x350mm , individual parts available

 

TCP500 High Quality Thermally Conductive Pad for Cell Phone

4.50 W/mk High Thermal Conductivity, High Quality Thermally Conductive Pad for Cell Phone

 

High Performance Thermally Conductive gap filler pads

High Performance Thermally Conductive gap filler pads from SinoGuide Technology. Ultra High Thermally Conductive Pads with Exceptional Dielectric Strength.

 

TCP110U Thermal Conductive Gap Filler Pad Materials

Customized TCP110U Thermal Conductive Gap Filler Pad; Thermal conductivity:1.10 W/mk; Fiberglass Reinforcement; Naturally tacky on one side for easy assembly; Electrically insulating; Resist to puncture,shear and tear

 

TCP750 7.5W/m.k Heat Conductive Silicon Thermal Heatsink Pad

7.50 W/mk High Thermal Conductivity,Low Thermal Resistance at Low Pressure, Naturally tacky for easy application

 

TCP200 Thermal Silicon Gap Insulation Pad For Heat Sink

TCP200 Series Thermal Pad; 2.00 W/mk thermal conductivity Thermal Insulation Pad, Low Thermal Resistance at Low Pressure, Naturally tacky for easy applicaiton

 

TCP300 Wholesale Thermal Conductive Silicone Pad Used in PCB

TCP300 Thermal Conductive Silicone Pad Used In PCB Features: 3.00 W/mk thermal conductivity Low Thermal Resistance at Low Pressure Naturally tacky for easy application Applications: Between heat-generation Conponment and and heatsink. Led Solid State Lighting, Graphices Cards, Telecom devic

 

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