TCP200 Thermal Silicon Gap Insulation Pad For Heat Sink

TCP200 silicone thermal pad has a 2.0 W/mK thermal conductivity for exceptionally low thermal resistance. For greater ease of application and use, the pad's natural inherent tack eliminates the need for an additional adhesive coating that may inhibit thermal performance by increasing interfacial resistance.

Products Features:

◇35 and 50 W/mk Outstanding Thermal Conductivity
◇Carbon Fiber Filled,High Stability and Suitable For Extreme Enviroment
◇Non- tacky and good rebound for easy applicaiton
◇Non- tacky and good rebound for easy applicaiton

Thermal Silicon Gap Insulation Pad For Heat Sink

Typical Applications Include:

Network Equipement, Mass Storage devices
Highly Stable at extreme Temperature
Required for outstanding heating Transfer
Cooling Module, Thermal module for Special application

Typical Properties of This Materials:

Typical Properties of TCP200 Silicone Thermal Pad
Properties	Units	TCP200	Test Method
Material	---	Silicone	---
Color	---	Dark Gray	Visual
Thickness Range	mm	0.25 to 15	---
Natural tacky (1- or 2-sided)	g/cm3	2	---
Hardness	Shore C	15,25,35	ASTM E1269
Density	g/cc	2.3	ASTM E595
Continuous Use Temp	℃	-40 to 200	EN344
ELECTRICAL
Breakdown Voltage(1mmT)	Kv/ac	≥9	ASTM D149
Volume Impedance	(ohm-cm)	≥3.6x10¹³	ASTM D257
Dielectric Constant	1MHz	6.0	ASTM D150
Flame Rating		V 0	UL 94
THERMAL
Thermal Conductivity	W/m.k	2.0	ASTM D5470

Configurations Available:

Sheet size:200 x 400mm, 350x350mm , individual parts available

0.50mm thickness material with fiberglass reinforecement

Its soft and compliant resin formulation is suitable for fragile components, and it does not crumble, flake, tear or come apart.

Part No. Code: