TCP300 Wholesale Thermal Conductive Silicone Pad Used in PCB

Products Features:

◇3.00 W/mk thermal conductivity
◇Low Thermal Resistance at Low Pressure
◇Naturally tacky for easy application

Typical Applications Include:

Between heat-generation component and heatsink
Led Solid State Lighting, Graphices Cards, Telecom device
Wireless communication hardware
Cooling Module, Thermal module.
High Power supply/conversion

Typical Properties of This Materials:

Typical Properties of TCP300 Silicone Thermal Pad
Properties	Units	TCP300	Test Method
Material	---	Silicone	---
Color	---	Blue	Visual
Thickness Range	mm	0.25 to 15	---
Natural tacky (1- or 2-sided)	g/cm3	2	---
Hardness	Shore C	25,35	ASTM E1269
Density	g/cc	2.6	ASTM E595
Continuous Use Temp	℃	-60 to 200	EN344
ELECTRICAL
Breakdown Voltage(1mmT)	Kv/ac	≥6	ASTM D149
Volume Impedance	(ohm-cm)	≥1.1x10¹⁴	ASTM D257
Dielectric Constant	1MHz	6.8	ASTM D150
Flame Rating		V 0	UL 94
THERMAL
Thermal Conductivity	W/m.k	3.0	ASTM D5470

Sheet size: 200 x 400mm, 350x350mm , individual parts available

Part No. Code:

Wholesale Thermally Conductive Silicone Adhesive Pad Used In Led Lights And Cell Phones

Suffix: Different Options For thermal Pad as below

"A1" suffix: One side additional adhesive such as 3M 467, 3M9448

"A2" suffix: Two sides additional adhesive such as 3M 467, 3M9448

"NA" suffix: Natural tacky

"D" suffix: one side tacky and non-tacky on the other side

"M" suffix: Fiberglass reinforcement in the middle layer

"F" suffix: Fiberglass reinforcement on top or bottom layer

Check List of Reliability Test Report for TCP300 is available after your request

Wholesale Thermally Conductive Silicone Adhesive Pad Used In Led Lights And Cell Phones

Below info will be helpful for your right application

How to transfer or dissipate the heat from the heat-generating components to heat sinks?

How To Select the Right Thermal Interface Materials for your new application?

Pls feel free to contact us as Thermal Management Solutions available in SinoGuide.

Gobal Leader in Thermal Interface Materials