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TCP110U Thermal Conductive Gap Filler Pad Materials


TCP110U has a 1.1 W/mK thermal conductivity for exceptionally low thermal resistance. Naturally tacky on one side for easy assembly,  A special resin material that is easy to pull from the liner and place in the application enhances handling. Endowed with stress absorbing flexibility, the gap filler pad TCP110U is reinforced with a fiberglass carrier on one side for easy handling and enhanced puncture, shear, and tear resistance. 

Products Features:

 Thermal conductivity: 1.10 W/mk;
Fiberglass Reinforcement;
Naturally tacky on one side for easy assembly;
Electrically insulating;
Resist to puncture,shear and tear;

Typical Applications Include:


---Network Equipement, Mass Storage devices
---Highly Stable at extreme Temperature
---Required for outstanding heating Transfer
---Cooling Module, Thermal module for Special application


Typical Properties of This Materials:


Typical Properties of TCP110U Silicone Thermal Pad
Properties Units TCP110U Test Method
Material --- Silicone/Fiberglass ---
Color --- Pink/white Visual
Thickness Range mm 0.5~10 ---
Natural tacky (1- or 2-sided) g/cm3 1 ---
Hardness Shore C 5,15 ASTM E1269
Density g/cc 2.2 ASTM E595
Continuous Use Temp -60 to 200 EN344
Breakdown Voltage(1mmT) Kv/ac ≥6 ASTM D149
Volume Impedance (ohm-cm) ≥6.2x1015 ASTM D257
Dielectric Constant 1MHz 5.5 ASTM D150
Flame Rating   V 0 UL 94
Thermal Conductivity W/m.k 1.1 ASTM D5470



Standard Sheet and Roll Sizes:

Sheet size: 200mmx400mm,300mm x 300mm,individual parts available. Roll Form available(300mm width)


TCP110U Application Guide:

Electrically Isolating Heat Insulation Pad,Electronic Thermal Pad


  Part No.Code:


 Electrically Isolating Heat Insulation Pad,Electronic Thermal Pad



Suffix: Different Options For thermal Pad as below

“A1” suffix: One side additional adhesive such as 3M 467, 3M9448

“NA” suffix: Natural tacky


Check List of Reliability Test Report for TCP110U is available after your request



Electrically Isolating Heat Insulation Pad,Electronic Thermal Pad



Below info will be helpful for your right application

How to transfer or dissipate the heat from the heat-generating components to heat sinks?

How To Select the Right Thermal Interface Materials for your new application?

Pls feel free to contact us as Thermal Management Solutions available in SinoGuide.




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