Thermal Gap Filler Pad is design to be used in the applications that require the minimum amount of pressure on components and high thermal conductivity. SinoGuide Thermal Gap Filler Pad is very conformable, filled silicone rubber material and has 1.7-7.5 w/m-k conductivity grades; it is easy to fill in air gaps between PC board and heat sinks or a metal chassis. Our Thermal Gap Filler Pad is naturally tacky, requiring no adhesive coating to inhabit thermal performance. It can also be with specific coating becoming single side tacky to allow easy material handling and installation.

Features and Benefits Typical Applications
High thermal conductivity
Nature tacky or no sticky on carrier side
Cooling components to chassis,frame,or other mating components
RoHs Compliance
Memory Modules
Home and small office network equipment
Mass storage devices
Automotive electronics
Telecommunication hardware
LED solid state lighting
Power electronics
LCD and PDP flat Panel
Set top boxes
Audio and video component
IT infrastructure

Typical Properties of TCP500 Silicone Thermal Pad
Properties	Units	TCP500	Test Method
Composition	---	Silicone	---
Color	---	Pink~Violet	Visual
Thickness Range	mm	0.25 to 15	---
Natural tacky (1- or 2-sided)		2	---
Hardness	Shore C	30	ASTM E1269
Density	g/cc	3.7	ASTM E595
Continuous Use Temp	℃	-60 to 200	EN344
ELECTRICAL
Breakdown Voltage(1mmT)	Kv/ac	≥6	ASTM D149
Volume Impedance	(ohm-cm)	≥7.1x10¹⁰	ASTM D257
Dielectric Constant	1MHz	6.6	ASTM D150
Flame Rating		V 0	UL 94
THERMAL
Thermal Conductivity	W/m.k	5.0	ASTM D5470