--Network Equipement, Mass Storage devices
--Industrial Automation, Telecom Device
--Smart TV Stick, Wireless Hub,Flat Panel displays, Power supply.
Typical Properties of TCSF200 Silicone-Free Thermal Conductive Pad | |||||||
Properties | Units | TCSF200 Series | Test Method | ||||
Material | --- | Acrylic | --- | ||||
Color | --- | Grey | Visual | ||||
Thickness | mm | 0.5 to 5 | --- | ||||
Hardness | Shore 00 | 60 | ASTM D2240 | ||||
Density | g/cc | 3.13 | ASTM D792 | ||||
Heat Capacity | 1/g-K | 1.1 | ASTM E1269 | ||||
Outgassing TML | --- | 0.12% | ASTM E595 | ||||
Outgassing CVCM | --- | 0.06% | ASTM E595 | ||||
Continuous Use Temp | ℃ | -60 to 200 | EN344 | ||||
ELECTRICAL | |||||||
Dielectric Breakdown Voltage | Vac | ≥200 Vac/mil | ASTM D149 | ||||
Volume Impedance | ohm-cm | 6.0 x109 | ASTM D257 | ||||
Flame Rating | V 0 | UL 94 | |||||
THERMAL | |||||||
Thermal Conductivity | W/m.k | 2.0 | ASTM D5470 |
Note: Standard Roll Form: 300mm(W) x 50m (L) or 76M (L) , Custom configuration Available
Below info will be helpful for your right application
How to transfer or dissipate the heat from the heat-generating components to heat sinks?
How To Select the Right Thermal Interface Materials for your new application?
Pls feel free to contact us as Thermal Management Solutions available in SinoGuide.
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