Thermal Conductive Putty/Gel

Products Features:

◇3.0 W/mk Thermal Conductivity,Good Thixotropism
◇Soft and ultra high compressibility for low stress applications
◇Higher viscosity compound than grease, it eliminates the bleed, separation,pump-out & dirtly other parts usually associated with grease.

Typical Applications Include:

--Between heat-generation Conponment and and heatsink.
--Automotive engine control, Graphices Cards, Telecom device.
--Wireless Hub,Military equipment, power supply.
--Entire large panel PCB Cooling
--Any high compression low stess application

Typical Properties of This Materials:

Typical Properties of Thermal Conductive Putty/Gel
Properties	Units	TCP300P	TCP300G	Test Method
Construction & Composition	---	White or Light Blue	White or Light Blue	---
Color	---	Black	Black	Visual
Min. BondlineThickness	mm	NA	0.1	---
Thickness	mm	1.0 to 5.0	NA	---
Density	(g/cm)	2.88	2.88	ASTM D792
Hardness	Shore 00	5	NA	ASTM D2240
Viscosity	@0.5rpm	≤100	≤100	ASTM D149
Temperature Range	℃	-40 to 200	-40 to 200	EN344
Volume Impedance	(ohm-cm)	5 x10¹⁴	1 x10¹³	ASTM D150
Flame Rating		V 0	V 0	UL 94
Thermal Conductivity	W/m.k	3.0	3.0	ASTM D5470

Below info will be helpful for your right application

How to transfer or dissipate the heat from the heat-generating components to heat sinks?

How To Select the Right Thermal Interface Materials for your new application?

Pls feel free to contact us as Thermal Management Solutions available in SinoGuide.

Contact Us

Tel.:+86-755-89375091 Fax.:+86-755-89375092 E-mail: sales@sg-thermal.com
Address: Block A, No 3, Zhonghe Street, Pinghu Town, Longgang District, Shenzhen City, China

Gobal Leader in Thermal Interface Materials