Gobal Leader in Thermal Interface Materials

Silicone-Free Thermal Conductive Pad TCSF200

Full Range Of Silicone-Free Thermal Conductive Pad


Products Features:

2.00 W/mk thermal conductivity 
Silicone-Free Thermal Pad 
Naturally tacky for easy applicaiton 
Electrically insulating
Silicone-Free Thermal Pad



Typical Applications Include:


--Network Equipement, Mass Storage devices
--Industrial Automation, Telecom Device
--Smart TV Stick, Wireless Hub,Flat Panel displays, Power supply. 

Typical Properties of This Materials:


Typical Properties of TCSF200 Silicone-Free Thermal Conductive Pad
Properties Units TCSF200 Series Test Method
Material --- Acrylic ---
Color --- Grey Visual
Thickness mm 0.5 to 5 ---
Hardness Shore 00 60 ASTM D2240
Density g/cc 3.13 ASTM D792
Heat Capacity 1/g-K 1.1 ASTM E1269
Outgassing TML --- 0.12% ASTM E595
Outgassing CVCM --- 0.06% ASTM E595
Continuous Use Temp -60 to 200 EN344
Dielectric Breakdown Voltage Vac ≥200 Vac/mil ASTM D149
Volume Impedance ohm-cm 6.0 x109 ASTM D257
Flame Rating   V 0 UL 94
Thermal Conductivity W/m.k 2.0 ASTM D5470



Note: Standard Roll Form: 300mm(W) x 50m (L) or 76M (L) , Custom configuration Available


Below info will be helpful for your right application

How to transfer or dissipate the heat from the heat-generating components to heat sinks?

How To Select the Right Thermal Interface Materials for your new application?

Pls feel free to contact us as Thermal Management Solutions available in SinoGuide.


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Tel.:+86-755-89375091 Fax.:+86-755-89375092 E-mail: sales@sg-thermal.com
Address: Block A, No 3, Zhonghe Street, Pinghu Town, Longgang District, Shenzhen City, China