Silicone-Free Thermal Conductive Pad TCSF200

Full Range Of Silicone-Free Thermal Conductive Pad

Products Features:

◇2.00 W/mk thermal conductivity
◇Silicone-Free Thermal Pad
◇Naturally tacky for easy applicaiton
◇Electrically insulating

Typical Applications Include:

--Network Equipement, Mass Storage devices
--Industrial Automation, Telecom Device
--Smart TV Stick, Wireless Hub,Flat Panel displays, Power supply.

Typical Properties of This Materials:

Typical Properties of TCSF200 Silicone-Free Thermal Conductive Pad
Properties	Units	TCSF200 Series	Test Method
Material	---	Acrylic	---
Color	---	Grey	Visual
Thickness	mm	0.5 to 5	---
Hardness	Shore 00	60	ASTM D2240
Density	g/cc	3.13	ASTM D792
Heat Capacity	1/g-K	1.1	ASTM E1269
Outgassing TML	---	0.12%	ASTM E595
Outgassing CVCM	---	0.06%	ASTM E595
Continuous Use Temp	℃	-60 to 200	EN344
ELECTRICAL
Dielectric Breakdown Voltage	Vac	≥200 Vac/mil	ASTM D149
Volume Impedance	ohm-cm	6.0 x10⁹	ASTM D257
Flame Rating		V 0	UL 94
THERMAL
Thermal Conductivity	W/m.k	2.0	ASTM D5470

Note: Standard Roll Form: 300mm(W) x 50m (L) or 76M (L) , Custom configuration Available

Below info will be helpful for your right application

How to transfer or dissipate the heat from the heat-generating components to heat sinks?

How To Select the Right Thermal Interface Materials for your new application?

Pls feel free to contact us as Thermal Management Solutions available in SinoGuide.

Contact Us

Tel.:+86-755-89375091 Fax.:+86-755-89375092 E-mail: sales@sg-thermal.com
Address: Block A, No 3, Zhonghe Street, Pinghu Town, Longgang District, Shenzhen City, China

Gobal Leader in Thermal Interface Materials