Low Oil Bleed Thermal Pad_Custom Thermal Materials

Products Features:

◇Thermal conductivity: 1.10 W/mk;
◇Fiberglass Reinforcement;
◇Naturally tacky on one side for easy assembly;
◇Electrically insulating;
◇Resist to puncture,shear and tear;

Typical Applications Include:

Network Equipement, Mass Storage devices
Highly Stable at extreme Temperature
Required for outstanding heating Transfer
Cooling Module, Thermal module for Special application

Typical Properties of This Materials:

Typical Properties of TCP110U Silicone Thermal Pad
Properties	Units	TCP110U	Test Method
Material	---	Silicone/Fiberglass	---
Color	---	Pink/white	Visual
Thickness Range	mm	0.5~10	---
Natural tacky (1- or 2-sided)	g/cm3	1	---
Hardness	Shore C	5,15	ASTM E1269
Density	g/cc	2.2	ASTM E595
Continuous Use Temp	℃	-60 to 200	EN344
ELECTRICAL
Breakdown Voltage(1mmT)	Kv/ac	≥6	ASTM D149
Volume Impedance	(ohm-cm)	≥6.2x10¹⁵	ASTM D257
Dielectric Constant	1MHz	5.5	ASTM D150
Flame Rating		V 0	UL 94
THERMAL
Thermal Conductivity	W/m.k	1.1	ASTM D5470

Standard Sheet and Roll Sizes:

Sheet size: 200mmx400mm,300mm x 300mm,individual parts available. Roll Form available(300mm width)

TCP110U Application Guide:

Electrically Isolating Heat Insulation Pad,Electronic Thermal Pad

Suffix: Different Options For thermal Pad as below

“A1” suffix: One side additional adhesive such as 3M 467, 3M9448

“NA” suffix: Natural tacky

Check List of Reliability Test Report for TCP110U is available after your request

Thermal gap pads remove heat in computers, tablets & electronic applications. Our thermal interface pads are available for a wide range of gap sizes. SinoGuide wide range of thermally conductive pads are designed to provide a heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices.

Learn More: Lowest Oil-leaking Thermal Gap Pad for Diminishing Potential

Gobal Leader in Thermal Interface Materials