3D Mould Thermal Conductive Pad_Custom Thermal Materials

Thermal gap pads remove heat in computers, tablets & electronic applications. Our thermal interface pads are available for a wide range of gap sizes. SinoGuide wide range of thermally conductive pads are designed to provide a heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices.

Products Features:

◇Various thermal conductivity ;
◇Customerize thermal Pad for perfect compliance;
◇Easy assembly and application;

Typical Applications Include:

---Mobile phone, Set-Top Box, Power Modules/Supply;
---Telecom device;
---Network Router/Adapter;
---Vehicle-interlligence Terminal;

Typical Properties of This Materials:

Typical Properties of 3D Mould Thermal Conductive Pad
Properties	Units	3D Mould Thermal Pad	Test Method
Material	---	Silicone	---
Color	---	Gray, Green	Visual
Min Thickness	mm	0.30mm	---
Elongation	(%)	>40%	ASTM D412
Hardness	Shore C	40, 55	ASTM D2240
Density	g/cc	>2.7	ASTM 792
Continuous Use Temp	℃	-60 to 200	EN344
ELECTRICAL
Breakdown Voltage	(VAC/mil)	≥250	ASTM D149
Volume Impedance	(ohm-cm)	≥5x10¹³	ASTM D257
Dielectric Constant	1MHz	5.5	ASTM D150
Flame Rating		V 0	UL 94
THERMAL
Thermal Conductivity	W/m.k	2.0, 5.0, 6.0	ASTM D5470

Configurations Available:

Customized parts, 3D drawing is required

SinoGuide Disclaimer:

Any information contained herein is believed to be accurate and reliable. SinoGuide and its agents does not assume any responsibility or liability for any advice furnished by it, or for the performance or results of any installation or use of the product(s) or of any final products into which the product(s) may be incorporated by the purchaser and/or user. The purchaser and/or user should perform its own tests to determine the suitability and fitness of the product (s) for the particular purpose desired in any given situation.

Gobal Leader in Thermal Interface Materials