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TCG250 Thermal Conductive Grease/Thermal Interface Material




2.5 W/mk Thermal Conductivity,Good Thixotropism
Soft and ultra high compressibility for low stress applications
Higher viscosity compound than grease, it eliminates the bleed,
separation,pump-out & dirtly other parts usually associated with grease





Smart TV stick/USB, Dongle
Automotive engine control, Graphices Cards, Telecom device.
Ideal applications for various mechnical gap tolerances for different heating-generation componment on the PCB
Be used by screen print,syringe,high volume of automated dispense


Typical Properties of TCG250 Silicone Thermal Grease
Properties Units TCG250 Test Method
Composition --- Silicone ---
Color --- White Visual
Viscosity(mPa·s at 0.3rpm) mPa·s at 0.3rpm 20000 ---
Density g/cc 2.7 ASTM E595
Continuous Use Temp -60 to 160 EN344
Thermal Resistance@50psi ℃-in2/W 0.014 ASTM D5470
Thermal Conductivity W/m.k 2.5 ASTM D5470
Shelf Life 2 Years from the date of manufacture at 25℃


Standard Package:

1 KG / Container; 5 KG / Container




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