Features:
2.5 W/mk Thermal Conductivity,Good Thixotropism
Soft and ultra high compressibility for low stress applications
Higher viscosity compound than grease, it eliminates the bleed,
separation,pump-out & dirtly other parts usually associated with grease
Applications:
Smart TV stick/USB, Dongle
Automotive engine control, Graphices Cards, Telecom device.
Ideal applications for various mechnical gap tolerances for different heating-generation componment on the PCB
Be used by screen print,syringe,high volume of automated dispense
Typical Properties of TCG250 Silicone Thermal Grease | ||||
Properties | Units | TCG250 | Test Method | |
Composition | --- | Silicone | --- | |
Color | --- | White | Visual | |
Viscosity(mPa·s at 0.3rpm) | mPa·s at 0.3rpm | 20000 | --- | |
Density | g/cc | 2.7 | ASTM E595 | |
Continuous Use Temp | ℃ | -60 to 160 | EN344 | |
THERMAL | ||||
Thermal Resistance@50psi | ℃-in2/W | 0.014 | ASTM D5470 | |
Thermal Conductivity | W/m.k | 2.5 | ASTM D5470 | |
Shelf Life | 2 Years from the date of manufacture at 25℃ |
Standard Package:
1 KG / Container; 5 KG / Container
Main Industry Application
Customer Help
Production Line
Technical Product Support
Tel.:+86-755-89375091 Fax.:+86-755-89375092 E-mail: sales@sg-thermal.com
Address: Block A, No 3, Zhonghe Street, Pinghu Town, Longgang District, Shenzhen City, China
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