Gobal Leader in Thermal Interface Materials

TCG150 Thermal Conductive Grease/Paste

Provide optimal heat transfer between CPU and heatsink through a metal oxide compound

Products Features:

◇1.5 W/mk Thermal Conductivity, Good Thixotropism
◇Soft and ultra high compressibility for low stress applications
◇Higher viscosity compound than grease, it eliminates the bleed,
◇separation,pump-out & dirtly other parts usually associated with grease






Products Applications:


Smart TV stick/USB, Dongle
Automotive engine control, Graphices Cards, Telecom device.
Ideal applications for various mechnical gap tolerances for different heating-generation componment on the PCB
Be used by screen print, syringe, high volume of automated dispense

Typical Properties of This Material Type:

Typical Properties of TCG150 Silicone Thermal Grease
Properties Units TCG150 Test Method
Composition --- Silicone ---
Color --- White Visual
Viscosity mPa·s at 0.3rpm 45000 ---
Density g/cc 2.6 ASTM E595
Continuous Use Temp -60 to 160 EN344
Thermal Resistance@50psi ℃-in2/W 0.021 ASTM D5470
Thermal Conductivity W/m.k 1.5 ASTM D5470
Shelf Life 2 Years from the date of manufacture at 25℃

Thermal paste easily fills voids between heat sources and heat sinks. By displacing the air from these nooks-and-crannies, a lower thermal resistance is achieved. Notably, the thermal paste material can be applied only where you need it, thereby minimizing waste. The materials can also be reworked because they do not adhere to substrates. The low hardness of Sinoguide’s Gap Filler products minimizes stress on delicate electronic components.


SinoGuide Technology - YOUR BEST STRATEGIC PARTNER Thermal Management Materials and Solutions

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Contact Us

Tel.:+86-755-89375091 Fax.:+86-755-89375092 E-mail: sales@sg-thermal.com
Address: Block A, No 3, Zhonghe Street, Pinghu Town, Longgang District, Shenzhen City, China