TCG150 Thermal Conductive Grease/Paste

Provide optimal heat transfer between CPU and heatsink through a metal oxide compound

Products Features:

◇1.5 W/mk Thermal Conductivity, Good Thixotropism
◇Soft and ultra high compressibility for low stress applications
◇Higher viscosity compound than grease, it eliminates the bleed,
◇separation,pump-out & dirtly other parts usually associated with grease

Products Applications:

Smart TV stick/USB, Dongle
Automotive engine control, Graphices Cards, Telecom device.
Ideal applications for various mechnical gap tolerances for different heating-generation componment on the PCB
Be used by screen print, syringe, high volume of automated dispense

Typical Properties of This Material Type:

Typical Properties of TCG150 Silicone Thermal Grease
Properties	Units	TCG150	Test Method
Composition	---	Silicone	---
Color	---	White	Visual
Viscosity	mPa·s at 0.3rpm	45000	---
Density	g/cc	2.6	ASTM E595
Continuous Use Temp	℃	-60 to 160	EN344
THERMAL
Thermal Resistance@50psi	℃-in2/W	0.021	ASTM D5470
Thermal Conductivity	W/m.k	1.5	ASTM D5470
Shelf Life	2 Years from the date of manufacture at 25℃

Contact Us

Tel.:+86-755-89375091 Fax.:+86-755-89375092 E-mail: sales@sg-thermal.com
Address: Block A, No 3, Zhonghe Street, Pinghu Town, Longgang District, Shenzhen City, China

Gobal Leader in Thermal Interface Materials