Features:

  

3.00 W/mk thermal conductivity 
Low Thermal Resistance at Low Pressure
Naturally tacky for easy application

 

Applications:

 

 Between heat-generation component and heatsink

 Led Solid State Lighting, Graphices Cards, Telecom device
 Wireless communication hardware
 Cooling Module, Thermal module.
 High Power supply/conversion

 

Typical Properties of TCP300 Silicone Thermal Pad
Properties	Units	TCP300		Test Method
Composition	---	Silicone		---
Color	---	Blue		Visual
Thickness Range	mm	0.25 to 15		---
Natural tacky (1- or 2-sided)		2		---
Hardness	Shore C	25,35		ASTM E1269
Density	g/cc	2.6		ASTM E595
Continuous Use Temp	℃	-60 to 200		EN344
ELECTRICAL
Breakdown Voltage(1mmT)	Kv/ac	≥6		ASTM D149
Volume Impedance	(ohm-cm)	≥1.1x1014		ASTM D257
Dielectric Constant	1MHz	6.8		ASTM D150
Flame Rating		V 0		UL 94
THERMAL
Thermal Conductivity	W/m.k	3.0		ASTM D5470

 

Configurations Available:

Sheet size:200 x 400mm, 350x350mm , individual parts available

 

Part No. Code:

 

 

Suffix: Different Options For thermal Pad as below

 

"A1" suffix: One side additional adhesive such as 3M 467, 3M9448

"A2" suffix: Two sides additional adhesive such as 3M 467, 3M9448

"NA" suffix: Natural tacky

"D" suffix: one side tacky and non-tacky on the other side

"M" suffix: Fiberglass reinforcement in the middle layer

"F" suffix: Fiberglass reinforcement on top or bottom layer

 

Check List of Reliability Test Report for TCP300 is available after your request

 

  

 

 

Below info will be helpful for your right application

How to transfer or dissipate the heat from the heat-generating components to heat sinks?

How To Select the Right Thermal Interface Materials for your new application?

Pls feel free to contact us as Thermal Management Solutions available in SinoGuide.

 

 

 

Certifications: