“An award Winning Firm”

4.0w/m.k Thermal Interface Pads from SinoGuide

New TCP400 thermal interface pads from SinoGuide provide 4.0 W/mK of thermal conductivity between hot components and heat sinks at lower costs than competing gap filler materials. Pads of TCP400 thermal gap fillers are soft and compliant for easy compression and filling of air gaps between mounting surfaces to optimize heat transfer. Applications for these gap fillers include alternative energy, consumer electronics, telecommunications, power supplies, flat panel displays, and portable electronics.



Lower pricing is available for TCP-S materials with lower thermal conductivities, i.e. 2.0 and 1.0 W/mK (TCP-S20 and TCP-S10). A low silicone content version, TCP400LS, has less than 50 parts per million silicone content for applications where silicone-based outgassing can lead to contamination problems or oily silicone residues can hamper assembly. All TCP-S series gap fillers are provided in 200 x 400 mm sheets or in standard die cut shapes. Custom shapes are available. Standard materials have a Shore 00 hardness of 45. Standard thicknesses range from 0.5 to 5.0 mm. All materials are UL94 V0 rated and have a use temperature range of -60° to +200° C.

-->Pads of TP-S30 thermal gap fillers are soft and compliant for easy compression and filling of air gaps between mounting surfaces to optimize heat transfer
-->Applications for these gap fillers include alternative energy, consumer electronics, telecommunications, power supplies, flat panel displays, and portable electronics
 

Manufactures a Line of Thermal Interface Materials 

Our dedicated and professional Sales and Service team is ready to assist you from prototype to production.

Fastest Turn-around Time

With our large in-stock inventory of materials, SinoGuide offers the fastest turn-around time in the industry.