Standard Silicone Base Thermal Pads
SinoGuide TCP500 series thermal pads have a high conductivity of 5.0 W/m*K. Thermal interface material pads or thermal pads are space saving solutions to managing heat. They are used to fill the gaps between heat sinks and microprocessors. Even when not seen by the naked eye, microscopic air bubbles can be present in this space between the components, which when heated can harm the long term productivity and lifespan of the entire product. Our products line thermal pad(sheet thermal interface material) series are the solutions that prevent these air gaps from harming your system’s components while maintaining excellent thermal conductivity.
SinoGuide’s thermal products, come in a variety of different types and sizes. They come in a large range of thermal conductivities from 1.0 W/m*K up to 7.0 W/m*K. Thicknesses are also flexible from 0.25 mm and up. They also use different materials depending on the application’s requirements such as silicone and acrylic rubber. They are available with both sides being self-tacky or one side-tacky. Finally, die cutting is an option available upon request. Standard Silicone-Base Thermal Pads TCP500 Series thermal pads have a high conductivity of 5.0 W/m*K and is available in 0.5 mm to 10 mm thicknesses.
“Thermal interface material(TIM) or Thermal Pad is space saving solutions to managing heat. They are used to fill the gaps between heat sinks and microprocessors. Our thermal interface materials come in a variety of different types and size.
Main Industry Application
Customer Help
Production Line
Technical Product Support
Tel.:+86-755-89375091 Fax.:+86-755-89375092 E-mail: sales@sg-thermal.com
Address: Block A, No 3, Zhonghe Street, Pinghu Town, Longgang District, Shenzhen City, China
copyright@2007-2015@SinoGuide Technology Ltd.