Silicone-Free Thermal Conductive Pad, Professional Thermal Management Solutions
Main Features:
Typical Applications Include:
| Typical Properties of TCSF200 Silicone-Free Thermal Pad | ||||
| Properties | Units | TCSF200 | Test Method | |
| Composition | --- | Acrylic | --- | |
| Color | --- | Grey | Visual | |
| Thickness | mm | 0.5 to 5 | --- | |
| Thickness Tolerance | +/-0.02mm | --- | ||
| Heat Capacity(1/g-K) | (1/g-K) | 1.1 | ASTM E1269 | |
| Outgassing TML | --- | 0.12% | ASTM E595 | |
| Outgassing CVCM | --- | 0.06% | ASTM E595 | |
| Hardness | (Shore 00) | 60 | ASTM D2240 | |
| Density(g/cm) | --- | 3.13 | ASTM D792 | |
| Continuous Use Temp | ℃ | -60 to 200 | EN344 | |
| ELECTRICAL | ||||
| Dielectric Breakdown Voltage | (Vac) | ≥200 Vac/mil | ASTM D149 | |
| Volume Impedance | (ohm-cm) | <500 | ASTM D257 | |
| Flame Rating | V 0 | UL 94 | ||
| THERMAL | ||||
| Thermal Conductivity | W/m.k | 2.0 | ASTM D5470 | |
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Tel.:+86-755-89375091 Fax.:+86-755-89375092 E-mail: sales@sg-thermal.com
Address: Block A, No 3, Zhonghe Street, Pinghu Town, Longgang District, Shenzhen City, China
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