Customized TCP110U Thermal Conductive Gap Filler Pad; Thermal conductivity:1.10 W/mk; Fiberglass Reinforcement; Naturally tacky on one side for easy assembly; Electrically insulating; Resist to puncture,shear and tear
5.0 W/mk Thermal Conductivity,Good Thixotropism; Soft and ultra high compressibility for low stress applications; Higher viscosity compound than grease, it eliminates the bleed; separation,pump-out & dirtly other parts usually associated with grease
3.0 W/mk Thermal Conductivity thermal grease; Thermal Conductive Putty TCP300P Thermal Conductive Gel TCP300G
Features: 1.6 W/mk Thermal Conductivity High conformability and cost effective Excellent electrically insulating mounted applications Applications: Between high power component (such as MOSFET) and a heatsink for screw and clip mounted
Features: 1.6 W/mk Thermal Conductivity High conformability and cost effective Excellent electrically insulating mounted applications Applications: Between high power component (such as Mosfet) and a heatsink for screw and clip mounted appl
Features: 1.6 W/mk Thermal Conductivity High conformability and cost effective Excellent electrically insulating mounted applications Applications: Between high power component (such as MOSFET) and a heatsink for screw and clip mounted appl
Features and Benefits -All of our Thermal Conductive Adhesive Tape is used for bonding heat disspation fins to microprocessor or power consumption semiconductors, utlimate bonding strength with lower thermal resistance without mechanical
7.50 W/mk High Thermal Conductivity,Low Thermal Resistance at Low Pressure, Naturally tacky for easy application
Our Perfect Thermal Conductive Grease CPU silicon thermal Grease grey thermal paste Computer heatsink compounds Helps disperse the heatfrom CPU Introductions: This thermal grease paste is suitable for CPU heatsink or chip, and it is syringe
TCP200 Series Thermal Pad; 2.00 W/mk thermal conductivity Thermal Insulation Pad, Low Thermal Resistance at Low Pressure, Naturally tacky for easy applicaiton
TCP300 Thermal Conductive Silicone Pad Used In PCB Features: 3.00 W/mk thermal conductivity Low Thermal Resistance at Low Pressure Naturally tacky for easy application Applications: Between heat-generation Conponment and and heatsink. Led Solid State Lighting, Graphices Cards, Telecom devic
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